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Canadian Nano Fab Selects SUSS Wafer Bonder
SUSS
MicroTec., a leading supplier of precision manufacturing
and test equipment for the semiconductor and emerging
markets announced today that the University of Alberta’s
NanoFab has selected its new ELAN CB6L wafer bonding
equipment for its research and production activities.
The NanoFab is an open access micro and nano fabrication
facility which is currently being used by over 130 research
groups from the University of Alberta, other Canadian
Universities and industry. The SUSS ELAN CB6L manual
bonder will be used in nanotechnology research, pressure
sensors for the oil industry, and RF MEMS switches for
wireless applications.
“The micro and nano fabrication equipment in
our facility is virtually unequaled in Canada,”
says Dr. Ken Westra, Director of the NanoFab, which
boasts an equipment set worth more than $20 million.
Westra has over 20 years experience in MEMS fabrication,
thin films, and microfabrication in both industry and
academia. “We are pleased to invest in the SUSS
bonder as part of our strategy to provide the latest
MEMS process technologies to our research partners,”
he said.
“The University of Alberta is one of the best
microfabrication research labs in North America,”
says Michael Kipp, President, Wafer Bonder Division,
SUSS MicroTec, Waterbury, Vermont, USA. “We are
pleased that they have chosen the ELAN bonder to support
process advances at the R&D level. In addition,
researchers using the NanoFab will benefit from the
ability to easily transfer technology developed on the
ELAN bonder to any SUSS production wafer bonding system.”
The ELAN CB6L manual wafer bonder is designed specifically
for research, development, and pre-production wafer
bonding markets. It has the same core technology as
the SUSS fully automated bonders - including precise
temperature and force control during bonding, as well
as computer controlled wafer processing - to ensure
high-accuracy post bond alignment. Based on field-proven
wafer bonding technology and supported by world-renown
SUSS engineering and applications expertise, the ELAN
is well suited for MEMS, optoelectronic, advanced packaging,
and SOI applications.
Visit www.suss.com
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